Mohan Charan Majhi laid the foundation for India’s first glass substrate chip packaging unit in Bhubaneswar, developed by 3D Glass Solutions Inc. with ₹1,943 crore investment. The facility will use advanced 3DHI technology for AI, 5G, and defence applications, creating over 2,500 jobs. It strengthens India’s semiconductor ecosystem, reduces import dependence, and aligns with national efforts to expand high-tech manufacturing capacity.
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